| PART |
Description |
Maker |
| 15975 15975-B |
BOX 2.13 X 1.38 X.58 PLASTIC BLK
BOX 2.13 X 1.38 X.58 PLASTIC GRY
HTSNK A LONG .9H LOW FLOW. THREADED
|
VICOR[Vicor Corporation]
|
| 19-130041 19-130040 |
BOX 4.15X2.4X.85 9V W/CLP ALMOND
ConverterPACs are the family of slide-in output assemblies used in MegaPAC power supplies
|
VICOR[Vicor Corporation]
|
| WM8733 |
BOX 4.38X3.25X2.51 9V BLK
|
Wolfson Microelectronics
|
| APM9966C APM9966COC-TR APM9966OC-TR APM9966 APM996 |
BOX ABS PLASTIC BLK 4.3X2.9X1.0,1 双N沟道增强型MOS
Dual N-Channel Enhancement Mode MOSFET 双N沟道增强型MOS
|
Anpec Electronics, Corp.
ETC[ETC]
ANPEC[Anpec Electronics Coropration]
ANPEC Electronics Corporation
|
| 2SC1815 C1815 E000670 1815 |
BOX 4.94 X 2.75 X .94 STD BLK 硅npnEpitaxail类型（通用音频放大器应用）
FILTER PLATE
Silicon NPN Epitaxail Type(for Audio Frequency General Purpose Amplifier Applications)
From old datasheet system
|
Toshiba, Corp.
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| CLP1000CF200 CLP1000CF20011 CLP1000BG200 CLP1000AB |
CAPACITORS ALUMINIUM ELECTROLYTIC STANDARD TEMP. SNAP-IN CLP
D TYPE CONNECTORS LOW COST DUAL PORT RIGHT ANGLE
CAPACITORS ALUMINIUM ELECTROLYTIC STANDARD TEMP. SNAP-IN CLP
|
Dubilier
|
| S1T8527C S1T8527C01-Q0R0 |
1 CHIP CLP SUBSYSTEM IC
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
|
| KB8527 KB8527BQ |
1 CHIP CLP SUBSYSTEM IC
|
Samsung Electronic
|
| EL2160C-1 |
SWITCH, ON-OFF, BLK/BLK BTN; Switch function type:SPST Latching; Voltage, contact AC max:125V; Voltage, contact DC max:24V; Temp, op. max:85(degree C); Temp, op. min:-40(degree C); Diameter, panel cut-out:13.6mm; Length / Height, RoHS Compliant: Yes
|
Elantec Semiconductor
|
| CLP0612 |
LAN Transformer< SMD Type: CLP Series>
|
Sumida Corporation
|
| VFFC-1/4-0 VFFC-3/4-0 VFFC-3/32-0 VFFC-3/32-0-4FT |
HEAT SHRINK BLK 5M
HEAT SHRINK BLK 1.2M 热缩120万座
|
TE Connectivity, Ltd.
Optrex America, Inc.
|
| SM3015 |
HEATSINK TO-92 .72 BLK
|
SamHop Microelectronics Corp.
|
